HY880 Thermal Paste – High Performance Thermal Compound (1g)

HY880 is a high-quality thermal paste designed to improve heat transfer between processors and heatsinks in consoles, PCs, and other electronics. It provides reliable thermal conductivity and stable performance across a wide temperature range, making it well-suited for console repairs, refurbishments, and preventative maintenance.

Ideal for replacing dried or degraded factory paste on CPUs and GPUs in systems like the Xbox, PlayStation, and other heat-sensitive hardware.

Key Features

• Thermal Conductivity: 5.15 W/mK

• Net Weight: 1 g (single-use to small multi-use tube)

• Low thermal impedance for efficient heat transfer

• Non-conductive and safe for electronics

• Smooth viscosity for easy, controlled application

Temperature Ratings

• Operating Temperature: −30°C to 280°C

• Instantaneous Temperature Resistance: up to 340°C

Composition

• Silicone compound base

• Carbon compound and oxidized metal fillers for improved thermal performance

Ideal For

• Console CPU / GPU thermal paste replacement

• Xbox, PlayStation, and similar systems

• Small form-factor electronics and heatsinks

• Repair kits and preventative maintenance

Notes

• Clean old thermal material completely before application

• Apply a small, even amount for best results

• Not electrically conductive